Apple is set to make significant changes to its processor designs with the upcoming M5 Pro, M5 Max, and M5 Ultra chips. Ming-Chi Kuo, a well-known Apple analyst, suggests that the company plans to separate the CPU and GPU cores, which are currently integrated on a single chip in the M-series processors. This new design aims to provide “server-grade” performance by enhancing production yields and thermal management.
The M5 Pro and its counterparts will utilize TSMC’s latest System-in-Integrated-Chips-Molding-Horizontal (SoIC-mH) process, allowing different chips to be combined in one package. By separating the CPU and GPU, Apple expects to boost production yields and thermal efficiency. Mass production of the M5 Pro and M5 Max is slated to begin in the second half of 2025, while the M5 Ultra will follow in 2026.
Apple’s M5 performance enhancement plan
The baseline M5 chip is expected to start mass production in the first half of 2025. The M5 series chips will be based on TSMC’s advanced N3P node.
Kuo also indicates that the M5 Pro processors might find applications in server technology, suggesting a wider range of use beyond consumer devices. This technological shift could lead to significant improvements in servers and high-performance computing tasks. However, the impact of separating the CPU and GPU on Apple’s general computing devices, such as laptops and desktops, which have benefited from the unified architecture, remains to be seen.
This transition highlights Apple’s ongoing efforts to innovate in chip design, focusing on increasing performance and thermal efficiency. The company aims to maintain its competitive edge over rivals like AMD and Intel.
